GL-12 840 Points Solderless Breadboard for Prototyping

GL-12 840 Points Solderless Breadboard – For Electronics Prototyping

The GL-12 840-Point Solderless Breadboard is a full-size prototyping board that provides ample space for building and testing complex circuits without soldering. With 840 tie points arranged in standard 2.54mm pitch rows, it accommodates DIP ICs, through-hole components, and all standard development board modules.

Key Specifications

• Total Tie Points: 840
• Terminal Strip: 63 rows × 10 columns (split into two halves)
• Bus Strips: 4 power rails (2 per side)
• Pitch: 2.54mm (0.1") standard
• Body Material: ABS plastic (flame retardant)
• Contact Material: Phosphor bronze with nickel plating
• Dimensions: ~165mm × 55mm
• Adhesive Base: Self-adhesive backing for mounting

Compatibility & Use Cases

This breadboard is compatible with all standard through-hole components and development boards including Arduino UNO, ESP32, NodeMCU, Raspberry Pi Pico, and sensor modules. Common applications include:

• Rapid circuit prototyping without soldering
• Testing and debugging sensor and actuator circuits
• Building power supply and voltage regulator circuits
• IC-based circuit design (555 timer, op-amps, logic gates)
• STEM and educational electronics project builds

The interlocking design allows multiple breadboards to be joined side-by-side for larger circuit builds.

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